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WEICON Fast-BondStructural and Assembly Adhesivefast-curing, high adhesive force, neutral in odour
WEICON Fast-Bond is pasty and levels out unevennesses (gap-levelling). It is free of silicone and solvents, overpaintable, non-shrinking and neutral in odour when curing. >> Brochure/ Technical data *1 Waterproof gluing according to DIN EN 204 D4 Important Note:
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Technical data:Chemical basis: PolyurethaneColour: beige-white Density: 1,50 g/cm³Viscosity: pasty Content/Packaging: 310 ml/PE cartridge Temperature resistance: -30°C to +100°C Heat resistant bonding acc. to WATT 91: +90°C Skin-over time*: approx. 3 minutes Handling strength*: approx. 10 minutes Cure speed*: approx. 3 mm/24 h Tensile strength acc. to DIN EN 204: approx. 10 N/mm² Waterproof gluing cc. to DIN EN 204: D4 Processing temperature: +5°C to +35°C Curing system: moisture cure Storage: cool (+5°C to +25°C) and dry, protect from temperatures exceeding +40°C Shelf life with room temperature: 12 months in unopened cartridge *1 Waterproof gluing according to * Standard climate: +23°C and 50% relative humidity of air |
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